Without knowing if the layout must be exactly the way you have done I recommend complete rearranging components the way that high-speed signals can have much better routes from CM connector to the corresponding connector. Now it looks like connectors are placed the way they look good and after you have figured out how to route signals using multiple layers and vias. The result is that (at least what I can assume) there are high-speed signals on four layers. I suggest doing the opposite: component placement should be done on the terms of routing possibilities taking reference plane (and other HS principles) into account. First look where signals are placed on the CM connector and then plan the board layout accordingly. Then you can have better power pours too.
I did not look any further what comes to individual components (except the usb3 protection which was mentioned above. It is definitely a nogo like that).
Whether the board works like that... well, your guess is as good as mine.
There are tons of good videos and web pages instructing high-speed signal routing.
I did not look any further what comes to individual components (except the usb3 protection which was mentioned above. It is definitely a nogo like that).
Whether the board works like that... well, your guess is as good as mine.
There are tons of good videos and web pages instructing high-speed signal routing.
Statistics: Posted by gotaf80307 — Sun May 04, 2025 5:44 pm